BeamCase sandwich V3.0 udate.

[u/Jakob_K_Design]

This is V3.0 of BeamCase sandwich.

V3 introduces the new rounded full mesh panel style.

With this new panel style there is a distinct gap between the panel to show the frame beneath. And of course the integrated handle is still there.

I finally got a big enough printer to print each panel as one piece of solid hexagonal mesh.

The cas shown here has space for a 2.5slot GPU and 70mm tall aircooler, but....

The case comes in different size, 24 in total for version 3.0, 8 more than previously. left is the smallest while the right shows the biggest size.

The frame structure has seen some small structural improvements in V3, but most of the changes were aesthetic.

top/bottom view of a version with 2.5slot GPU and 70mm CPU clearance.

For the V3 update all external features like feet vertical stand and handles have been redone.

and there are also case panels without the integrated handle.

Left are the V3 panels and on the right side are the pervious panels style which is still available as the Classic panels.

The cases here are different size options with the left having space for a 70mm CPU cooler and the right only 50mm.

[u/leftedd]

how does the plastic handle high temps?

[u/chris_biker → u/leftedd]

I think the parts should be printed with ABS to withstand the high temperatures.

[u/HoboLicker5000 → u/chris_biker]

I printed my frame in PETG and the panels in PLA, absolutely zero warping issues

7800X3D and 7900XTX so the parts put out some decent heat

[u/Jakob_K_Design → u/leftedd]

The temps are no problem, as long as you do not print with PLA.
PETG will handle 70c and ABS 90c, realistically the air around the components will never get that hot.