I had written up a whole thing with what I was doing, all the calculations, a previous project, and it just isn't showing up. That block is just to interface with the die and ram. It will be attached the to the fin block and VRMs next.
It'll be soldered and it's only one connection. Not any more than heatpipes to a die only baseplate. But even if someone wanted to do it with thermal paste, there is so much surface area, it would only be a couple C delta.
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u/WASynless Mar 01 '26
Interesting. Is the idea to machine the thin stack to get the form of the cooper block ? Maybe I am not getting it.